SMT Hybrid Packaging 2017: "Hardware for all"
The SMT Hybrid Packaging, international exhibition for System Integration in Micro Electronics, will take place from 16 to 18 May 2017 in new halls at the Nuremberg exhibition center. The proven concept to place the main topics along the value chain is continuing.
The main topics are displayed in three halls. The topics “System Development and Production Preparation” as well as “Materials and Components” will be presented in Hall 5. Hall 4,with its proximity to the thematically linked hall 4A, shows the visitors all about “Processes and Manufacturing”. And Hall 4A showcases the topics “Reliability and Test” and “Software and Production Control”.
Production line “Future Packaging”: Hardware for all
The production line “Future Packaging” organized by Fraunhofer IZM is unique in the world and shows the complete production process live onsite during the show times. Visitors can observe each single production step and get to know more about the relevant technologies. The production line 2017 is under the topic “Hardware for all”.