14 October 2025 
 
1 October 2015

Motek 2015: What can we expect from Industry 4.0?

MAP, CIM, Industry 4.0 – the catchwords change and integration capabilities advance, but the promise of benefits frequently lags behind the expectations. Fundamental scepticism is associated with this sober way of looking at things to a lesser degree by the practitioners amongst the manufacturers and distributors, and instead with a realistically current assessment of the predominantly prevailing situation.


The fact of the matter is that many suppliers and manufacturers of consumer goods and industrial products are already working within networked structures, and that a lively exchange of communication is taking place from the implementation of ideas right on up to maintenance, replacement parts and service support. This includes elements for work-order and process control, as well as the acquisition, evaluation and transmission of current quality and process-correction data. Nevertheless, the distributors and manufacturers have good reason to keep their cards close to their chests in order to be able to distinguish themselves from the competition by means of unique selling points (USPs) such as technologies, processes, process competence and know-how, and to turn this into an important profit factor.

The best example of this is the assembly systems and equipment manufacturing segment of the Motek international trade fair for production and assembly automation. Here more than anywhere else in the world, well over 130 manufacturers of assembly and automation solutions present their capabilities and expertise in various disciplines involving a variety of technologies and processes. Expert visitors from all over the world profit from a problem-solving as well as a commercial viewpoint, as do the exhibitors in the form of concrete RFQs and orders resulting therefrom.The combination of two trade fairs, namely the Motek international trade fair for production and assembly automation and the Bondexpo international trade fair for bonding technologies including the rapidly growing peripheral sector covering fastening and joining technology (mechanical and thermal), provides customers and users with standalone and complete system solutions which are ideally matched to their processes from a single source, or comprised of compatible subsystems from different manufacturers.

Supplemented with a broad range of offerings for components, assemblies and subsystems, high levels of integration are assured in accordance with the Industry 4.0 philosophy, or perhaps more accurately the Industry 4.0 strategy.

 

More news about "Motek":


8 October 2024

No fear of AI – Motek/Bondexpo is ready for the future

Companies in the manufacturing industry are facing major challenges – efficiency, cost-effectiveness, conservation of resources and a shortage of skilled labour. This year, suppliers and users will be exchanging ideas on how to further improve manufacturing processes at the Motek/Bondexpo industry platform. The stakes are high – and manufacturers need to prepare for the future. The industry’s traditional autumn event, complemented by a high-calibre supporting programme, aims to demonstrate new and viable paths. (more…)






20 November 2020

Motek/Bondexpo 2021: There’s Nothing Like a Live Event!

The industry is preparing for participation at Motek/Bondexpo in Stuttgart from the 5th through the 8th of October, 2021. As digital trade fair platforms, Motek-Virtual and Bondexpo-Virtual are currently proving their worth as effective and useful online marketplaces by making it possible to maintain business contacts between manufacturers and users, but all involved parties are nevertheless urgently awaiting the next edition of the on-site event. (more…)


23 July 2020

Next Motek/Bondexpo in October 2021

In cooperation with the exhibitor advisory board for Motek/Bondexpo 2020, trade fair promoters P. E. Schall GmbH & Co. KG have decided to postpone this year’s 39th Motek international trade fair for automation in production and assembly to 2021. (more…)


1 July 2020

Motek/Bondexpo 2020 Ready to Go

Together with the 14th Bondexpo international trade fair for bonding technologies, the 39th Motek international trade fair for automation in production and assembly is gearing up for take-off. Digitalisation will be one of the key issues of the industry highlight from 5 to 8 October 2020, and startup companies will also be provided with a special platform. An implementation concept is currently being worked out in close cooperation amongst the responsible authorities, venue operator Messe Stuttgart and trade fair promoters P. E. Schall GmbH & Co. KG, in order to comply with all of the requirements resulting from the corona pandemic. (more…)



 

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