electronica 2018

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Hier: https://www.exxpo.com/newsletter The Newsletter is presented by DIE MESSE: www.die-messe.de Trade Fair Schedule IT / Electrical Engineering 13-16 November, 2018 electronica Munich, Germany 13-14 November, 2018 protekt Leipzig, Germany 20-22 November, 2018 smacc - Smart Country Convention Berlin, Germany 27-29 November, 2018 SPS IPC Drives Nuremberg, Germany 06-08 December, 2018 LED Expo Greater Noida, India 08-11 January, 2019 CES Las Vegas, USA 09-11 January, 2019 eltec Nuremberg, Germany 13-15 February, 2019 ELEKTROTECHNIK Dortmund, Germany 15-17 February, 2019 DreamHack Leipzig, Germany 25-28 February, 2019 Mobile World Congress Barcelona, Spain 26-28 February, 2019 embedded world Nuremberg, Germany 19-21 March, 2019 CEBIT RUSSIA Moscow, Russia 19-21 March, 2019 EMV Stuttgart Stuttgart, Germany 20-22 March, 2019 electronica China Shanghai, China 20-22 March, 2019 productronica China Shanghai, China 20-21 March, 2019 LOPEC Munich, Germany 10-11 April, 2019 Smart Systems Integration Barcelona, Spain Anzeige Messestadt Düsseldorf DieRhein-Metropolepunktetmit regionalerund internationaler Gastronomie | Seite 16 Anzeige Anzeige AuflagengruppeR ,,Bepartof it :DieBranche zu GastaufderWeltleitmesse für MedizinundMedizintechnik MEDICAund COMPAMED 2016 Düsseldorf 14.bis17.November2016 LesenSiehierzuein InterviewaufSeite3 E inenDemonstrator,der aktive Implantatedrahtlos viaUltra- schallmit Energie versorgt, stel- lenWissenschaftlerdes Fraunho- fer-Instituts für Biomedizinische Technik (IBMT) in Sulzbach (Saar- land) auf derMedica inHalle 10, StandG05vor. DieTechnologie isteineAlternati- vezurEnergieversorgungmitBat- terieund Induktion.Die innovati- ve Lösung kommt platzsparend ohne integrierte Batterien aus und ist effizienter als eine induk- tiveEnergieübertragung. Platzsparendund energieeƥzient NeueTechnologieversorgtaktive ImplantateviaUltraschallmitEnergie From extremely sensitive robots towearables forallsituations:The digitalisationofhealthcare ispro- gressing at an unstoppable rate, and this concernsall fields,outpa- tientandclinicalcare,aswellaspa- tientsandphysiciansalike. Medica 2016will reflect this pro- cess – 5,000 exhibitors from around 70 countrieswill be pre- senting tailored solutions forout- patientandclinicalcare. Anunstoppableprocess Digitalwave is sweepingover thehealthcare sector Innovationen Sicherverbunden NeuartigerKunststoff fürLuer- Systeme | Seite 10 Enormaufnahmefähig MaßgeschneiderteAlginate für Wundauflagen | Seite 12 Light therapywithOLED New foundation for future thera- peuticapplications | Page8 Ausdem Inhalt: ePaper LesenSie digital www.exxpo.com/epaper/ medica_2016 Anzeige Readmoreonpage4 D50 Certifiedenterprisemanagement system ISO9001:2008 TUV Rheinland CNCMACHINEDPARTS www.oros.it FRPPHUFLDOH @oros.it SPIRIT OF PRECISION visitusat COMPAMED Düsseldorf Hall 8A StandM07 ANSMANNAG WELTNEUHEIT APPCONNECTED RECHARGEABLEBATTERYPACKS BMS ...seemoreon page14 Hall8B /E30 Havinghugepotential:healthapps Photo:MesseDüsseldorf /ctillmann Ultraschall-Technologie ist eine Alternative bei der Energiever- sorgungaktiver Implantate. Foto:Fraunhofer IBMT /MarkusMichel Whereautomationmeets future: Der internationaleMarktplatz derAutomatisierungsbranche spsipc drives2016 Nürnberg 22.bis24.November2016 Anzeige Anzeige Messestadt Nürnberg Gastronomie-Tipps fürdie Franken-Metropole | Seite 19 AuflagengruppeG LesenSiedaskomplette InterviewaufSeite3 W ie Industrie-4.0-Konzepte inmittelständischenUnter- nehmenumzusetzensind, isteine derKernfragen im Forum „Auto- mationmeets IT“ aufder sps ipc drives (Halle3A-451). „Das Gerüst für Industrie 4.0 stehtweitgehend, zum Beispiel unterdemBegriffRAMI4.0“,sagt PeterFrüauf,stellvertretenderGe- schäftsführer Elektrische Auto- mation imVerbandDeutscherMa- schinen-undAnlagenbau (VDMA). Jetzt gelte es, die Lösungswege indiePraxisumzusetzen,betont er imGesprächmit DIEMESSE . Wiedies gelingen kann,diskutie- rendie Experten aufdem Forum „Automationmeets IT“.Darüber hinausbieteauchderVDMAprak- tische Handreichungen – etwa mit Veröffentlichungenwie dem „Leitfaden Industrie4.0“oderder „Industrie4.0ReadinessStudie“. Industrie4.0:DasGerüst steht Forum„Automationmeets IT“diskutiertPraxis-Umsetzung fürMittelstand Scientists have developed a fle- xible system conceptusing radio frequency identification (RFID) sensors tomonitormachines in industrialenvironments.Through continuouswireless andbattery- freemeasurement of tempera- tureandotherparametersaswell asan intelligentanalysisofsensor data, it becomes possible to de- tect failure risks early and opti- mizemaintenance times. Detecting risksearly New systemusesRFID sensors tomonitormachines Messewelten Schaufensterder Automatisierung Industrie4.0Area,„Automation meets IT“und„MESgoes Automation“ | Seite6 Ausdem Inhalt: ePaper LesenSie digital www.exxpo.com/epaper/ sps_2016 Readmoreonpage 12 RFID sensor transponders can be installed in hard-to-access areasor rotatingmachineparts. Photo:Fraunhofer IPMS Smarte Fertigung in der Industrie 4.0: Das Gerüst steht, nun giltes,dieLösungswegeumzusetzen. Foto:PhoenixContact /VDMA Branchennews Standards required Thechallengeof Industry4.0: Datacommunicationhas tobe secured | Page9 Stand7-550 Halle7A/340 t r ab t s r g Düsseldorf DieRhein-Metropolepunktetmit regionalerund internationaler Gastronomie | Seite 12 AuflagengruppeC LesenSiedaskomplette InterviewaufSeite3 D iewachsendeNachfragenach neuen Leichtbaukomponen- ten – insbesondere durch die Automobilindustrie – sorgt bei den deutschen Aluminiumgie- ßereien für einen Investitions- schubundbefeuertdasMarktpo- tenzial der Branche. Gießereien würden „runderneuert“ bezie- hungsweise komplett neu ge- baut, skizziertMax Schumacher, Hauptgeschäftsführer des Bun- desverbands derDeutschenGie- ßerei-Industrie, die Aktivitäten derLeichtmetallgießereien imGe- sprächmit DIEMESSE . BefeuertesMarktpotenzial BedarfanneuenLeichtbau-Komponenten sorgt für Investitionsschub In 2016,Aluminiumwill focus on lightweight construction aswell as resource and cost efficien- cy. The trade fair inHalls 9 to 14 showcases new pioneering solu- tions formore efficiency in pro- duction and processing – from raw materials to semi-finished goods to finished products from the user industries, frommachi- nery toproductionplants and ac- cessories to surface treatments. Excellentopportunities Megatrend lightweightconstructionatAluminium ePaper LesenSie digital www.exxpo.com/epaper/ aluminium_2016 Readmoreonpage2 DerLeichtbau-Trend imAutomobilbauträgtzu„stabilpositiven Perspektiven“ imAluminiumgussbei. Foto:DieterSchütz /pixelio.de Anzeige Messewelten KostbarerRohstoff InZeiten chrumpfenderReser- venwirdRecyclingvonAlumi- nium immerwichtiger | Seite4 Innovationen Lightervehicles Advancedmanufacturing tech- nologiespave theway fornew, lightercars thatallowpollution tobe reduced | Page6 Ausdem Inhalt: Messestadt Aluminium 2016 showcases innovative lightweight construc- tion solutions. Photo:ReedExhibitionsDeutschlandGmbH • Cold-formed • Homogenousand gas-Ɵght • High-precision • Leight-weight • Process-secure ImpactExtrusionPartsyou can trust in! 29.Nov –1.Dez2016 MesseDüsseldorf Visions become reality. ProductsofNeumanAluminium ImpactExtrusion: Austria,Germany,USA,Slovakia,China Contact:GeraldReither gerald.reither@neuman.at Tel.:+432762500914 www.neuman.at 29.Nov –1.Dez2016 MesseDüsseldorf www.aluminium-messe.com Hall9 •Booth E15 Messe2013 Stadt 00.00.-00.00.2013 xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxx Anzeige Das neue Messeportal 4200MesseterminemitDatenundFakten InternationaleMessenews InnovationenausallenBranchen Leichtbau inBestform: DerinternationaleTreõpunktder globalenAluminiumbranche ALUMINIUM 2016 Düsseldorf 29.11.bis1.12.2016 Application of the ultra-low-power OLED microdisplay in stock management Foto: Fraunhofer FEP, photographer Claudia Jacquemin The scientists of the Department IC and System Design at the Fraunhofer FEP have developed the electronics and the display to bring them simply and fast into real augmented reality (AR) applica- tions. A display element by itself is not enough. The communication by the dis- play with other interfaces and systems is the key to applications. The extremely small size of the ultra-low-power OLED microdisplay is perfect for miniaturized and lightweight systems that are port- able and easy to integrate into clothing, helmets, and glasses. The OLED technol- ogy of the display provides sharp im- ages with extremely high contrast and brightness, ranging from 20 to 5,000 nits (monochrome green). Interested developers can now choose from three different display variants: displays with 304 × 128 pixels, 304 × 256 pixels and 720 × 256 pixels. The ultra-low-power electronics con- cept addresses applications for harsh environments such as disaster manage- ment, for example, but also for industry and telemedicine, where long battery runtime without interruption for re- charging is indispensable. These require- ments are met by the ultra-low-power characteristics. However, a display lives from the information that a data source sends and that are to be displayed. The ultra-low-power concept is not about high-resolution video data at the highest frame rates, but instead about the display of simple characters, data, or information that are transmitted as commands with low latency. In the event of a major fire with a large num- ber of emergency personnel, for exam- ple, the control center can use helmet integrated displays to quickly send pre- cise and easy-to-understand instructions to the firefighters on site. By integrating a display into the helmet, the display could also function in areas with low visibility due to smoke. The Fraunhofer FEP’s innovative Bluetooth kit lays the foundations for augmented reality. The ultra-low-power design benefits from the low data transfer rate it uses. It was therefore logical to implement information transmission via Bluetooth Low Energy (BLE), since this technol- ogy consumes very little battery power. In principle, however, the connection to narrow-band low-power radio data networks such as the Narrow-Band In- ternet of Things (NB-IoT) and LoRaWAN (long-range wide-area network) are also conceivable. Besides the display, the de- velopment kits contain everything re- quired, from the optics up to the graphi- cal user interface (GUI) for Windows or Android devices. The kits are tools for product developers as well as app devel- opers to test their ideas in a simple way. App-App-Hooray! Scientists have developed innovative kits for AR applications Organic electronics: power from socket Organic light-emitting devices and printed electronics can be connected to a socket in the wall by way of a small organic con- verter, developed jointly by Linköping University and Umeå University. Printed electronics and organic light-emitting devices now per- form at levels sufficient for a number of energy-efficient appli- cations. Previously the idea has been to drive the organic elec- tronics using solar cells, batteries or wireless transformers. But for fixed installations like lighting or signage, it is convenient to use a wall socket. Until now this has not been possible, because the high voltage damages the elec- tronics. The researchers have been able to demonstrate an organic con- verter that makes it possible to drive organic light-emitting de- vices with high luminescence, and to charge supercapacitors, both using electricity from an or- dinary wall socket. The converter consists of diode-connected or- ganic thin-film transistors, oper- ated at high voltages up to 325 V, with the capacity to transform high alternating current (AC) to a selected direct current (DC). “For the first time in the world we have been able to demonstrate an AC/DC converter in organic electronics that functions at volt- ages above 300 V,” says Deyu Tu, Linköping University. To be used in real products, the power con- version efficiency needs to be improved. Continued from page 1