SMT Hybrid Packaging 2018 attracts many exhibitors
A total of 80 per cent of the exhibition space has already been booked for the next SMT Hybrid Packaging in Nuremberg from 5 to 7 June 2018. The event is Europe's leading platform for system integration in microelectronics.
A range of significant national and international key players have already registered for the event in 2018. In 2017, a total of 35 percent of exhibitors came from abroad, predominantly from Switzerland, Great Britain and the Netherlands, once again reaffirming the event as the leading fair for system integration in microelectronics. The Newcomer Pavilion joint stand offers first time exhibitors with a Full Service Package at cost-effective rates enabling them to test their fair presentation without having to spend too much time on the organization.
Joint Stands – Specialized topics for a broad trade audience
Alongside the Newcomer Pavilion, there is a range of further informative joint stands at the SMT Hybrid Packaging 2018, which showcase companies, products and services in the areas of PCB, EMS and optoelectronics. The joint stand “Mixed Double – PCB meets Components“ hosts conductor boards, components and materials. The joint stand “EMS-Intersection“ is a platform for contract manufacturers. Products and solutions for all aspects of optoelectronics can be found at the joint stand "Optics meets Electronics".