On course for digitalisation
A consistent alignment to actual practice and a forward-looking approach represent the Motek international trade fair for automation in production and assembly, which took place in October.
Together with the concurrently held Bondexpo international trade fair for bonding technology and a comprehensive supplementary programme, the trade fair duo once again set the scene for global trading at the ultramodern trade fair venue in Stuttgart. 1049 exhibitors from 29 countries presented their companies on roughly 730,000 square feet of overall exhibition floor space and attracted the impressive number of 35,434 expert visitors with their distinctive range of products and services. The visitors came from 90 countries around the globe, which certainly makes it possible to draw conclusions concerning the great significance of Motek and Bondexpo as an internationally recognised business platform.
International visitors and exhibitors
These are very good figures for the year 2016 with its competing events, and above all after the record-breaking number of visitors who attended in 2015 – especially in light of the fact that the quality of the expert visitors with regard to decision-making authority, and in particular their propensity to invest, reached very high levels according to the statements of renowned and loyal as well as first-time Motek exhibitors.
Industry 4.0 in focus
As could not have been otherwise expected, the highly topical issues of Industry 4.0 and big data, as well as the associated digitalisation of the industrial environment, ran through the product and service offerings of Motek and Bondexpo as a common thread. There was hardly a component, a module, a stand-alone solution or a complete system that wasn’t equipped with the appropriate hardware and software interfaces for master control and communication.
And not alone Motek, but rather the Bondexpo international trade fair for bonding technology as well, which incidentally celebrated its 10th anniversary, was distinguished by its convincing presentation of products, know-how and competence with its own supplementary programme for the first time. It dealt with all of the issues surrounding bonding, sealing, joining and fastening technology, and special emphasis was placed upon manufacturing and assembly challenges in the field of lightweight design.
The Motek international trade fair for automation in production and assembly and the Bondexpo international trade fair for bonding technology will take place in 2017 at the Stuttgart Exhibition Centre from the 9th through the 12th of October.